? semiconductor components industries, llc, 2005 september, 2005 ? rev. 4 1 publication order number: MBRF20100CT/d MBRF20100CT preferred device switchmode schottky power rectifier the switchmode power rectifier employs the schottky barrier principle in a large area metal?to?silicon power diode. state?of?the?art geometry features epitaxial construction with oxide passivation and metal overlay contact. ideally suited for use as rectifiers in very low?voltage, high?frequency switching power supplies, free wheeling diodes and polarity protection diodes. features ? highly stable oxide passivated junction ? very low forward voltage drop ? matched dual die construction ? high junction temperature capability ? high dv/dt capability ? excellent ability to withstand reverse avalanche energy transients ? guardring for stress protection ? epoxy meets ul 94 v?0 @ 0.125 in ? electrically isolated. no isolation hardware required. ? ul recognized file #e69369 (note 1) ? pb?free package is available* mechanical characteristics: ? case: epoxy, molded ? weight: 1.9 grams (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead temperature for soldering purposes: 260 c max. for 10 seconds 1. ul recognized mounting method is per figure 4 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. device package shipping ordering information MBRF20100CT to?220 50 units/rail schottky barrier rectifier 20 amperes, 100 volts preferred devices are recommended choices for future use and best overall value. 2 1 3 http://onsemi.com MBRF20100CTg to?220 (pb?free) 50 units/rail isolated to?220 case 221d style 3 3 1 2 marking diagram b20100 aywwg b20100 = device code a = assembly location y = year ww = work week g = pb?free package
MBRF20100CT http://onsemi.com 2 maximum ratings (per leg) rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 100 v average rectified forward current (rated v r ), t c = 133 c total device i f(av) 10 20 a peak repetitive forward current (rated v r , square wave, 20 khz), t c = 133 c i frm 20 a non?repetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 150 a peak repetitive reverse surge current (2.0 s, 1.0 khz) i rrm 0.5 a operating junction and storage temperature range t j , t stg ? 65 to +150 c voltage rate of change (rated v r ) dv/dt 10000 v/ s rms isolation voltage (t = 1.0 second, r.h. 30%, t a = 25 c) (note 2) per figure 3 per figure 4 (note 1) per figure 5 v iso1 v iso2 v iso3 4500 3500 1500 v maximum ratings are those values beyond which device damage can occur. maximum ratings applied to the device are individual str ess limit values (not normal operating conditions) and are not valid simultaneously. if these limits are exceeded, device functional operation i s not implied, damage may occur and reliability may be affected. thermal characteristics (per leg) rating symbol value unit maximum thermal resistance, junction to case r jc 3.5 c/w lead temperature for soldering purposes: 1/8 from case for 5 seconds t l 260 c electrical characteristics (per leg) characteristic symbol max unit maximum instantaneous forward voltage (note 3) (i f = 10 amp, t c = 25 c) (i f = 10 amp, t c = 125 c) (i f = 20 amp, t c = 25 c) (i f = 20 amp, t c = 125 c) v f 0.85 0.75 0.95 0.85 v maximum instantaneous reverse current (note 3) (rated dc voltage, t c = 25 c) (rated dc voltage, t c = 125 c) i r 0.15 150 ma 1. ul recognized mounting method is per figure 4 2. proper strike and creepage distance must be provided. 3. pulse test: pulse width = 300 s, duty cycle 2.0% figure 1. typical forward voltage per diode figure 2. typical reverse current per diode 0.01 0.1 1.0 10 120 100 80 60 40 20 0 v r , reverse voltage (volts) i r , reverse current (ma) t j = 150 c t j = 125 c t j = 100 c t j = 25 c 0.5 0 v f , instantaneous voltage (volts) 1.0 3.0 5.0 10 20 50 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 i f , instantaneous forward current (amps) t j = 25 c 100 c 150 c
MBRF20100CT http://onsemi.com 3 test conditions for isolation tests* mounted fully isolated pack- age leads heatsink 0.110 min figure 3. clip mounting position for isolation test number 1 *measurement made between leads and heatsink with all leads shorted together. clip mounted fully isolated pack- age leads heatsink clip 0.107 min mounted fully isolated pack- age leads heatsink 0.107 min figure 4. clip mounting position for isolation test number 2 figure 5. screw mounting position for isolation test number 3 mounting information** 4?40 screw plain washer heatsink compression washer nut clip heatsink figure 6. typical mounting techniques 6a. screw?mounted 6b. clip?mounted laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a screw torque of 6 to 8 in . lbs is sufficient to provide maximum power dissipation capability. the compression washer helps to maintain a constant pressure on the package over time and during large temperature excursions. destructive laboratory tests show that using a hex head 4?40 screw, without washers, and applying a torque in excess of 20 in . lbs will cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability. additional tests on slotted 4?40 screws indicate that the screw slot fails between 15 to 20 in . lbs without adv ersely affecting the package. however, in order to positively ensure the package integrity of the fully isolated device, on semiconductor does not recommend exceeding 10 in . lbs of mounting torque under any mounting conditions. **for more information about mounting power semiconductors see application note an1040.
MBRF20100CT http://onsemi.com 4 package dimensions to?220 fullpak case 221d?03 issue g style 3: pin 1. anode 2. cathode 3. anode ?b? ?y? g n d l k h a f q 3 pl 123 m b m 0.25 (0.010) y seating plane ?t? u c s j r dim a min max min max millimeters 0.625 0.635 15.88 16.12 inches b 0.408 0.418 10.37 10.63 c 0.180 0.190 4.57 4.83 d 0.026 0.031 0.65 0.78 f 0.116 0.119 2.95 3.02 g 0.100 bsc 2.54 bsc h 0.125 0.135 3.18 3.43 j 0.018 0.025 0.45 0.63 k 0.530 0.540 13.47 13.73 l 0.048 0.053 1.23 1.36 n 0.200 bsc 5.08 bsc q 0.124 0.128 3.15 3.25 r 0.099 0.103 2.51 2.62 s 0.101 0.113 2.57 2.87 u 0.238 0.258 6.06 6.56 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch 3. 221d?01 thru 221d?02 obsolete, new standard 221d?03. on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2?9?1 kamimeguro, meguro?ku, tokyo, japan 153?0051 phone : 81?3?5773?3850 MBRF20100CT/d switchmode is a trademark of semiconductor components industries, llc. literature fulfillment : literature distribution center for on semiconductor p.o. box 61312, phoenix, arizona 85082?1312 usa phone : 480?829?7710 or 800?344?3860 toll free usa/canada fax : 480?829?7709 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.
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